Product Description:
It is mainly used to test the hardware and software of memory chips such as DRAM and NAND Flash, and check the connection between IP modules, so as to protect the circuit function and electrical performance parameters of semiconductor devices.
Product Features:
1. Newly designed architecture to ensure signal integrity under high data rate testing;
2. High speed digital channel, improve the parallel testing capability required by large volume products;
3. with flexible multi-site CPU architecture, can optimize the test time;
4. with an independent device-oriented engineering test system, suitable for the development and debugging of test programs;
5. High degree of flexibility reduces investment risk for all new generation NAND testing capabilities and engineering execution.
6. Adopt general protocol board, easy to upgrade, strong scalability, in order to achieve high return on investment (ROI).
7. Adopt modular architecture, reconfigure necessary functional modules flexibly according to application requirements, which can provide a wide range of test coverage and provide solutions at the best cost.